Thin Wall Packaging Asia 2017

Event Type: Conference
Event Date: From 2017-09-18 to 2017-09-19
Location: Singapore,Singapore
Contact person: Maud Lassara
Contact Email:

Event Description:

Thin Wall Packaging Asia 2017 is aimed at the value chain participants in the thermoformed and injection moulded packaging. The growth of organised retail in Asia as well as more formalised approach to product branding will have a significant impact on packaging demand in the region. The industry is in need of a clearer definition to facilitate the change. The new requirements are expected to drive the development of fast-cycle lightweight packaging, barrier packaging for long-life products and packaging with superior decoration (IML). Thin wall plastic packaging like tubs, cups, pots, trays and clamshells, provides a means of supplying consumer appeal, convenience and product protection.

Organized by: Applied Market Information
Deadline for abstracts/proposals: 07/05/2017

Check the event website for more details.