Hong Kong 26th International Conference on “Engineering & Technology, Computer, Basic & Applied Sciences” (ECBA- 2017) August 22-23, 2017 Hongkong

Event Type: Conference
Event Date: From 2017-08-22 to 2017-08-23
Location: Hong Kong,Hongkong
Website: http://academicfora.com/ecba-august-22-23-2017-hongkong/
Contact person: Leon Yap
Contact Email: hke487@academicfora.com

Event Description:

The conference will cover vital issues in Engineering & Technology, Computer, Basic and Applied Sciences Research & Practice under multiple sub-themes. The aim of our conference is to support, encourage and provide a platform for networking, sharing, publishing and nurturing the potential growth of individual scholars across the globe. Selected conference papers will be published in associated Scopus / ISI indexed journal. All other papers will be considered for Google scholar index journals.

Organized by: Academic fora
Deadline for abstracts/proposals: 08/15/2017

Check the event website for more details.